2 pack of Schmartboard|ez .5mm Pitch, 16 and 20 Pin QFP/QFN to DIP Adapter Plus a Free Breadboard
This product is a QFP and QFN to DIP adapter with a twist. These have our patented "ez" technology which means that soldering the surface mount component is simple, and as with all of our "ez" boards, we are the only company with a patented solution for easily soldering surface mount parts. This board supports .5mm pitch, 16 and 20 pin devices in both QFP and QFN packages. This board also includes room for 0805 SMT discrete components such as a bypass capacitor and pads for easy access to a ground. Additionally a plated hole in the center of the device area, allows for the addition of solder to utilize ground pads on the bottom of the device. A standard row of 40 headers has been included as a bonus for your convenience. It uses Schmartboards patented "EZ" technology which makes hand soldering surface mount fast, easy and flawless. It has pre routed traces to minimize the use of wire jumpers. It has easy access to copper ground. It makes it possible to breadboard surface mount components. In this bundle you get two of these boards plus a free 830 Test Point Breadboard. This top quality breadboard contains 830 tie points including four independent common bus lines for easy connections to common lines. This breadboard also has interlocking features that allow you to connect them together to make larger boards. The adhesive back, when utilized, is a great solution for adhering the board to project surfaces.
Once upon a time it was easy to prototype a circuit by hand soldering components on to a prototyping board, using wire wrap techniques or a breadboard. Today, our advanced electronics require the use of small and tight pitched components. It’s made it almost impossible to prototype. Schmartboard, and only Schmartboard, has solved this conundrum. Never before has it been so easy to hand solder surface mount components. Only Schmartboard has a patented technology that makes this possible. "Schmartboard|ez" makes it easy to solder SOIC, QFP, QFN and other component packages with pitches as small as .4mm.
Detailed Diagram
Mechanical Dimensions
Package Sizes Supported By This Board
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